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.gitignore
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@@ -2,3 +2,5 @@ venv/
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.esphome/
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custom/
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update-all.sh
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secrets.yaml
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*.stl
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83
README.md
83
README.md
@@ -1,56 +1,63 @@
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# MicroEnv v1.x
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# MicroEnv v2.x
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The MicroEnv is a compact and simplistic environmental monitoring sensor,
|
||||
based on the ESP32-C3 and the Sensirion SGP41 and SHT45 sensors, using
|
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ESPHome for integration with HomeAssistant
|
||||

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||||
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Use a MicroEnv near a source of emissions to monitor air quality, or as
|
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a general room environmental tracking sensor. It is, in effect, a cut
|
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down version of the environmental sensor package of my [Supersensor 2.x](https://github.com/joshuaboniface/supersensor2)
|
||||
project in a much smaller footprint.
|
||||
The MicroEnv is a compact and simplistic environmental monitoring sensor, based on the ESP32-C3 and the Sensirion SGP41 VOC/NOx and SHT45 temperature/humidity sensors, using ESPHome for integration with HomeAssistant.
|
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|
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Power is provided by USB-C, though a very slim connector is required when
|
||||
using SMD soldering without a buffer.
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Use a MicroEnv near a source of emissions to monitor air quality, evaluate temperatures, or as a general room environmental tracking sensor. It is, in effect, a cut down version of the environmental sensor package of my [SuperSensor](https://github.com/joshuaboniface/supersensor) project in a standalone footprint designed for maximum temperature accuracy.
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The Sensirion sensors are elevated with through-hole pins, to ensure
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optimal distance between the (warm) board and the sensors themselves.
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You can either directly solder the sensors to the board or, as I do,
|
||||
use 4-pin female sockets for easy changing should it be necessary.
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||||
Power is provided by USB-C, which is also used for initial flashing. Once running, the device connects to WiFi to provide data to Home Assistant or via the ESPHome WebUI/API.
|
||||
|
||||

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||||
The Sensirion sensors are directly soldered onto the board along with their power management circuitry, using SMD techniques, which is in contrast to the socketed GY-form-factor sensors from [version 1.x](https://github.com/joshuaboniface/microenv/tree/v1.x). This provides more compactness and flexibility in terms of positioning to ensure the temperature sensor is properly isolated from the rest of the system.
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||||
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||||
Version 2.x features an extended 5mm-width, 40mm-length "neck", the end of which contains the SHT45 temperature sensor, for maximum isolation from the ESP32 and SGP41 sensor, both of which produce heat which can negatively affect the SHT45 temperature. This emulates the design of many temperature probe devices which use similar long boards for isolation purposes and work quite well in this regard.
|
||||
|
||||

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||||
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||||
The PCB design details and assembly instructions can be found [in /board](board/) and on [OSHWLab](https://oshwlab.com/joshuaboniface/microenv-2-0).
|
||||
|
||||
Since this revision uses directly SMD-mounted components, it requires fine soldering using solder paste and either a hotplate or, with extreme care, hot air soldering techniques. It is strongly recommended that anyone attempting to build one read the datasheets for the [SHT45](https://sensirion.com/media/documents/33FD6951/67EB9032/HT_DS_Datasheet_SHT4x_5.pdf) and [SGP41](https://sensirion.com/media/documents/5FE8673C/61E96F50/Sensirion_Gas_Sensors_Datasheet_SGP41.pdf) sensors thoroughly to ensure they are not subject to overheating which can result in potential damage or incorrect operation. We recommend using low-temperature GA-SN solder paste for this purpose, and suggest ordering the PCB with lead-free HASL to facilitate this.
|
||||
|
||||
## v1.x Compatibility
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||||
The only changes between v1.x and v2.x are in the board layout and component mounting; for software purposes, both versions are functionally identical aside from versioning. Thus all changes should be ported to both the `v1.x` and `v2.x` branches. There is no `master` branch.
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## Parts List
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||||
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| Qty | Component | Cost (mid-2025 CAD, ex. shipping) | Links |
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||||
|-------|---------------------|-----------------------------------|-------|
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||||
| 1 | GY-SGP41 | $9.58 | [AliExpress](https://www.aliexpress.com/item/1005007958589642.html) |
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||||
| 1 | GY-SHT45 | $5.67 | [AliExpress](https://www.aliexpress.com/item/1005008175340220.html)* |
|
||||
| 1 | ESP32-C3 | $3.12 | [AliExpress](https://www.aliexpress.com/item/1005007205044247.html) |
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||||
| 2 | Female 4-pin header | $0.37 ($14.99/40) | [Amazon](https://www.amazon.ca/dp/B08LF3S5S8) |
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||||
| 1 | Custom PCB (JLC) | $0.50 ($5.00/10) | [GitHub](https://github.com/joshuaboniface/microenv/tree/master/board) |
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||||
| **TOTAL** | | **$19.24** | |
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||||
**Note:** All prices are $CAD, as of late November 2025, excluding shipping, sales, and bulk discounts beyond those indicated.
|
||||
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||||
`*` Ensure you select the correct device on the page as it shows multiple options.
|
||||
**Note:** For AliExpress item links marked `*`, ensure you select the correct device; multiple different models share the page.
|
||||
|
||||
## Configurable Options
|
||||
| Qty | PCB ID(s) | Component | Cost | Links |
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||||
|-------|-----------|------------------------------------------------|---------------------|-------|
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||||
| 1 | N/A | PCB - "MicroEnv" | $0.64 ($3.20/5) | [EasyEDA/JLCPCB](/board/pcb.easyeda.json) |
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||||
| 1 | ESP32-C3 | ESP32-C3 development board (SMD) | $2.46 ($12.28/5) | [AliExpress](https://www.aliexpress.com/item/1005007205044247.html)* |
|
||||
| 1 | SHT4x | Sensirion SHT45-AD1F-R2 | $9.37 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/sensirion-ag/SHT45-AD1F-R2/17180856) |
|
||||
| 1 | SGP4x | Sensirion SGP41-D-R4 | $13.00 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/sensirion-ag/SGP41-D-R4/15652788) |
|
||||
| 1 | R1 | CR1206-FX-10R0ELFCT-ND (10Ω 1% 1/4W 1206) | $0.16 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/bourns-inc/CR1206-FX-10R0ELF/2562695) |
|
||||
| 1 | C1 | 399-C0805C106K8PACTUCT-ND (10μF 10V X5R 0805) | $0.19 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/kemet/C0805C106K8PACTU/1090830) |
|
||||
| 1 | C2 | 399-C0805C104K5RACTUCT-ND (0.1μF 50V X7R 0805) | $0.12 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/kemet/C0805C104K5RACTU/411169) |
|
||||
| 1 | C3 | 399-C0805C105K3RACTUCT-ND (1μF 50V X7R 0805) | $0.18 | [DigiKey.ca](https://www.digikey.ca/en/products/detail/kemet/C0805C105K3RACTU/2211765) |
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||||
| **T** | | | **$26.14** | *plus tools, solder, etc.* |
|
||||
|
||||
There are several UI-configurable options with the MicroEnv to help you get
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||||
the most out of the sensor for your particular use-case.
|
||||
## Case
|
||||
|
||||
### Temperature Offset (selector, -30 to +10 @ 0.1, -5 default)
|
||||
The MicroEnv design includes [a case to enclose the sensor](case/) while still providing good airflow to cool the microcontroller and provide quality exposure for the sensors. This case can be printed in any material, though ABS is recommended for rigidity and strength.
|
||||
|
||||
Allows calibration of the SHT45 temperature sensor with an offset from -30 to +10
|
||||
degrees C. Useful if the sensor is misreporting actual ambient tempreatures. Due
|
||||
to internal heating of the SHT45 by the ESP32, this defaults to -5; further
|
||||
calibration may be needed for your sensors and environment.
|
||||
## Calibration
|
||||
|
||||
### Humidity Offset (selector, -20 to +20 @ 0.1)
|
||||
Due to its design explicitly focusing on temperature accuracy, the MicroEnv should not require any Temperature Offset corrections in normal use; the option is however still provided just in case this is required in your environment.
|
||||
|
||||
Allows calibration of the SHT45 humidity sensor with an offset from -20 to +20
|
||||
percent relative humidity. Useful if the sensor is misreporting actual humidity.
|
||||
The heater component of the SHT45 is explicitly disabled, as this should only be required in extreme humidity conditions.
|
||||
|
||||
## Home Assistant View
|
||||
Like its parent SuperSensor, the MicroEnv provides several additional configurable options for a "Room Health" metric system. For more detail, see [the main SuperSensor README](https://github.com/joshuaboniface/supersensor/tree/v3.x/configuration#room-health) section on the Room Health system.
|
||||
|
||||
This image shows the various available sensors in Home Assistant.
|
||||
# Contributing
|
||||
|
||||

|
||||
If you wish to contribute to the MicroEnv project, please open a pull request in this repository. All pull requests will be carefully reviewed before inclusion, as we are extremely selective about what we modify. Note that any signifiant logical changes should also be compatible with the SuperSensor, and changes from that project will be occasionally integrated here.
|
||||
|
||||
Please ensure you target the correct branch(es) for your changes. Currently we are supporting both `v1.x` and `v2.x` in software as noted above, and there is no `master`/`main` branch. This support of both `v1.x` and `v2.x` means a 1-to-1 correlation of functionality between those two versions, so any PR to one will be back- or forward-ported to the other, and your changes(s) must be compatable with both.
|
||||
|
||||
Any changes must be **globally applicable to all users** of the project; if you wish to maintain your own customizations that are only applicable for yourself, please fork the project and adjust your package import URL accordingly.
|
||||
|
||||
"AI" (LLM) contributions are not prohibited, but you - a human - **must** at least review, reformat, and test the changes yourself before submitting them. Obviously pure-LLM-generated PRs that do not function, mangle formatting or functionality, or otherwise clearly have no human review will be rejected with prejudice. This extends to the PR body itself: write in your own words, not the output of an LLM, and if you can't concisely sumarize the changes yourself, then we're not interested in them.
|
||||
|
||||
348
board/LICENSE
Normal file
348
board/LICENSE
Normal file
@@ -0,0 +1,348 @@
|
||||
Creative Commons Attribution-ShareAlike 4.0 International Public License
|
||||
|
||||
By exercising the Licensed Rights (defined below), You accept and agree
|
||||
to be bound by the terms and conditions of this Creative Commons
|
||||
Attribution-ShareAlike 4.0 International Public License ("Public
|
||||
License"). To the extent this Public License may be interpreted as a
|
||||
contract, You are granted the Licensed Rights in consideration of Your
|
||||
acceptance of these terms and conditions, and the Licensor grants You
|
||||
such rights in consideration of benefits the Licensor receives from
|
||||
making the Licensed Material available under these terms and
|
||||
conditions.
|
||||
|
||||
|
||||
Section 1 -- Definitions.
|
||||
|
||||
a. Adapted Material means material subject to Copyright and Similar
|
||||
Rights that is derived from or based upon the Licensed Material
|
||||
and in which the Licensed Material is translated, altered,
|
||||
arranged, transformed, or otherwise modified in a manner requiring
|
||||
permission under the Copyright and Similar Rights held by the
|
||||
Licensor. For purposes of this Public License, where the Licensed
|
||||
Material is a musical work, performance, or sound recording,
|
||||
Adapted Material is always produced where the Licensed Material is
|
||||
synched in timed relation with a moving image.
|
||||
|
||||
b. Adapter's License means the license You apply to Your Copyright
|
||||
and Similar Rights in Your contributions to Adapted Material in
|
||||
accordance with the terms and conditions of this Public License.
|
||||
|
||||
c. BY-SA Compatible License means a license listed at
|
||||
creativecommons.org/compatiblelicenses, approved by Creative
|
||||
Commons as essentially the equivalent of this Public License.
|
||||
|
||||
d. Copyright and Similar Rights means copyright and/or similar rights
|
||||
closely related to copyright including, without limitation,
|
||||
performance, broadcast, sound recording, and Sui Generis Database
|
||||
Rights, without regard to how the rights are labeled or
|
||||
categorized. For purposes of this Public License, the rights
|
||||
specified in Section 2(b)(1)-(2) are not Copyright and Similar
|
||||
Rights.
|
||||
|
||||
e. Effective Technological Measures means those measures that, in the
|
||||
absence of proper authority, may not be circumvented under laws
|
||||
fulfilling obligations under Article 11 of the WIPO Copyright
|
||||
Treaty adopted on December 20, 1996, and/or similar international
|
||||
agreements.
|
||||
|
||||
f. Exceptions and Limitations means fair use, fair dealing, and/or
|
||||
any other exception or limitation to Copyright and Similar Rights
|
||||
that applies to Your use of the Licensed Material.
|
||||
|
||||
g. License Elements means the license attributes listed in the name
|
||||
of a Creative Commons Public License. The License Elements of this
|
||||
Public License are Attribution and ShareAlike.
|
||||
|
||||
h. Licensed Material means the artistic or literary work, database,
|
||||
or other material to which the Licensor applied this Public
|
||||
License.
|
||||
|
||||
i. Licensed Rights means the rights granted to You subject to the
|
||||
terms and conditions of this Public License, which are limited to
|
||||
all Copyright and Similar Rights that apply to Your use of the
|
||||
Licensed Material and that the Licensor has authority to license.
|
||||
|
||||
j. Licensor means the individual(s) or entity(ies) granting rights
|
||||
under this Public License.
|
||||
|
||||
k. Share means to provide material to the public by any means or
|
||||
process that requires permission under the Licensed Rights, such
|
||||
as reproduction, public display, public performance, distribution,
|
||||
dissemination, communication, or importation, and to make material
|
||||
available to the public including in ways that members of the
|
||||
public may access the material from a place and at a time
|
||||
individually chosen by them.
|
||||
|
||||
l. Sui Generis Database Rights means rights other than copyright
|
||||
resulting from Directive 96/9/EC of the European Parliament and of
|
||||
the Council of 11 March 1996 on the legal protection of databases,
|
||||
as amended and/or succeeded, as well as other essentially
|
||||
equivalent rights anywhere in the world.
|
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|
||||
m. You means the individual or entity exercising the Licensed Rights
|
||||
under this Public License. Your has a corresponding meaning.
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|
||||
|
||||
Section 2 -- Scope.
|
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|
||||
a. License grant.
|
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|
||||
1. Subject to the terms and conditions of this Public License,
|
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the Licensor hereby grants You a worldwide, royalty-free,
|
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non-sublicensable, non-exclusive, irrevocable license to
|
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exercise the Licensed Rights in the Licensed Material to:
|
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|
||||
a. reproduce and Share the Licensed Material, in whole or
|
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in part; and
|
||||
|
||||
b. produce, reproduce, and Share Adapted Material.
|
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|
||||
2. Exceptions and Limitations. For the avoidance of doubt, where
|
||||
Exceptions and Limitations apply to Your use, this Public
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License does not apply, and You do not need to comply with
|
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its terms and conditions.
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||||
|
||||
3. Term. The term of this Public License is specified in Section
|
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6(a).
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||||
|
||||
4. Media and formats; technical modifications allowed. The
|
||||
Licensor authorizes You to exercise the Licensed Rights in
|
||||
all media and formats whether now known or hereafter created,
|
||||
and to make technical modifications necessary to do so. The
|
||||
Licensor waives and/or agrees not to assert any right or
|
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authority to forbid You from making technical modifications
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necessary to exercise the Licensed Rights, including
|
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technical modifications necessary to circumvent Effective
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Technological Measures. For purposes of this Public License,
|
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simply making modifications authorized by this Section 2(a)
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(4) never produces Adapted Material.
|
||||
|
||||
5. Downstream recipients.
|
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|
||||
a. Offer from the Licensor -- Licensed Material. Every
|
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recipient of the Licensed Material automatically
|
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receives an offer from the Licensor to exercise the
|
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Licensed Rights under the terms and conditions of this
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|
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Every recipient of Adapted Material from You
|
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automatically receives an offer from the Licensor to
|
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exercise the Licensed Rights in the Adapted Material
|
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under the conditions of the Adapter's License You apply.
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|
||||
c. No downstream restrictions. You may not offer or impose
|
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any additional or different terms or conditions on, or
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apply any Effective Technological Measures to, the
|
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Licensed Material if doing so restricts exercise of the
|
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Licensed Rights by any recipient of the Licensed
|
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Material.
|
||||
|
||||
6. No endorsement. Nothing in this Public License constitutes or
|
||||
may be construed as permission to assert or imply that You
|
||||
are, or that Your use of the Licensed Material is, connected
|
||||
with, or sponsored, endorsed, or granted official status by,
|
||||
the Licensor or others designated to receive attribution as
|
||||
provided in Section 3(a)(1)(A)(i).
|
||||
|
||||
b. Other rights.
|
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|
||||
1. Moral rights, such as the right of integrity, are not
|
||||
licensed under this Public License, nor are publicity,
|
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privacy, and/or other similar personality rights; however, to
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the extent possible, the Licensor waives and/or agrees not to
|
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assert any such rights held by the Licensor to the limited
|
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extent necessary to allow You to exercise the Licensed
|
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Rights, but not otherwise.
|
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|
||||
2. Patent and trademark rights are not licensed under this
|
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|
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3. To the extent possible, the Licensor waives any right to
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|
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|
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|
||||
Section 3 -- License Conditions.
|
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||||
Your exercise of the Licensed Rights is expressly made subject to the
|
||||
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|
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a. Attribution.
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|
||||
1. If You Share the Licensed Material (including in modified
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form), You must:
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|
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a. retain the following if it is supplied by the Licensor
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with the Licensed Material:
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||||
i. identification of the creator(s) of the Licensed
|
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attribution, in any reasonable manner requested by
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the Licensor (including by pseudonym if
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|
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|
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v. a URI or hyperlink to the Licensed Material to the
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b. indicate if You modified the Licensed Material and
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retain an indication of any previous modifications; and
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c. indicate the Licensed Material is licensed under this
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|
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|
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2. You may satisfy the conditions in Section 3(a)(1) in any
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reasonable manner based on the medium, means, and context in
|
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|
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|
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|
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b. ShareAlike.
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|
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In addition to the conditions in Section 3(a), if You Share
|
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Adapted Material You produce, the following conditions also apply.
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1. The Adapter's License You apply must be a Creative Commons
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license with the same License Elements, this version or
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|
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Adapter's License You apply. You may satisfy this condition
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in any reasonable manner based on the medium, means, and
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context in which You Share Adapted Material.
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|
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3. You may not offer or impose any additional or different terms
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or conditions on, or apply any Effective Technological
|
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Measures to, Adapted Material that restrict exercise of the
|
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rights granted under the Adapter's License You apply.
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|
||||
|
||||
Section 4 -- Sui Generis Database Rights.
|
||||
|
||||
Where the Licensed Rights include Sui Generis Database Rights that
|
||||
apply to Your use of the Licensed Material:
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||||
|
||||
a. for the avoidance of doubt, Section 2(a)(1) grants You the right
|
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to extract, reuse, reproduce, and Share all or a substantial
|
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portion of the contents of the database;
|
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|
||||
b. if You include all or a substantial portion of the database
|
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contents in a database in which You have Sui Generis Database
|
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Rights, then the database in which You have Sui Generis Database
|
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Rights (but not its individual contents) is Adapted Material,
|
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including for purposes of Section 3(b); and
|
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|
||||
c. You must comply with the conditions in Section 3(a) if You Share
|
||||
all or a substantial portion of the contents of the database.
|
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|
||||
For the avoidance of doubt, this Section 4 supplements and does not
|
||||
replace Your obligations under this Public License where the Licensed
|
||||
Rights include other Copyright and Similar Rights.
|
||||
|
||||
|
||||
Section 5 -- Disclaimer of Warranties and Limitation of Liability.
|
||||
|
||||
a. UNLESS OTHERWISE SEPARATELY UNDERTAKEN BY THE LICENSOR, TO THE
|
||||
EXTENT POSSIBLE, THE LICENSOR OFFERS THE LICENSED MATERIAL AS-IS
|
||||
AND AS-AVAILABLE, AND MAKES NO REPRESENTATIONS OR WARRANTIES OF
|
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|
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IMPLIED, STATUTORY, OR OTHER. THIS INCLUDES, WITHOUT LIMITATION,
|
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WARRANTIES OF TITLE, MERCHANTABILITY, FITNESS FOR A PARTICULAR
|
||||
PURPOSE, NON-INFRINGEMENT, ABSENCE OF LATENT OR OTHER DEFECTS,
|
||||
ACCURACY, OR THE PRESENCE OR ABSENCE OF ERRORS, WHETHER OR NOT
|
||||
KNOWN OR DISCOVERABLE. WHERE DISCLAIMERS OF WARRANTIES ARE NOT
|
||||
ALLOWED IN FULL OR IN PART, THIS DISCLAIMER MAY NOT APPLY TO YOU.
|
||||
|
||||
b. TO THE EXTENT POSSIBLE, IN NO EVENT WILL THE LICENSOR BE LIABLE
|
||||
TO YOU ON ANY LEGAL THEORY (INCLUDING, WITHOUT LIMITATION,
|
||||
NEGLIGENCE) OR OTHERWISE FOR ANY DIRECT, SPECIAL, INDIRECT,
|
||||
INCIDENTAL, CONSEQUENTIAL, PUNITIVE, EXEMPLARY, OR OTHER LOSSES,
|
||||
COSTS, EXPENSES, OR DAMAGES ARISING OUT OF THIS PUBLIC LICENSE OR
|
||||
USE OF THE LICENSED MATERIAL, EVEN IF THE LICENSOR HAS BEEN
|
||||
ADVISED OF THE POSSIBILITY OF SUCH LOSSES, COSTS, EXPENSES, OR
|
||||
DAMAGES. WHERE A LIMITATION OF LIABILITY IS NOT ALLOWED IN FULL OR
|
||||
IN PART, THIS LIMITATION MAY NOT APPLY TO YOU.
|
||||
|
||||
c. The disclaimer of warranties and limitation of liability provided
|
||||
above shall be interpreted in a manner that, to the extent
|
||||
possible, most closely approximates an absolute disclaimer and
|
||||
waiver of all liability.
|
||||
|
||||
|
||||
Section 6 -- Term and Termination.
|
||||
|
||||
a. This Public License applies for the term of the Copyright and
|
||||
Similar Rights licensed here. However, if You fail to comply with
|
||||
this Public License, then Your rights under this Public License
|
||||
terminate automatically.
|
||||
|
||||
b. Where Your right to use the Licensed Material has terminated under
|
||||
Section 6(a), it reinstates:
|
||||
|
||||
1. automatically as of the date the violation is cured, provided
|
||||
it is cured within 30 days of Your discovery of the
|
||||
violation; or
|
||||
|
||||
2. upon express reinstatement by the Licensor.
|
||||
|
||||
For the avoidance of doubt, this Section 6(b) does not affect any
|
||||
right the Licensor may have to seek remedies for Your violations
|
||||
of this Public License.
|
||||
|
||||
c. For the avoidance of doubt, the Licensor may also offer the
|
||||
Licensed Material under separate terms or conditions or stop
|
||||
distributing the Licensed Material at any time; however, doing so
|
||||
will not terminate this Public License.
|
||||
|
||||
d. Sections 1, 5, 6, 7, and 8 survive termination of this Public
|
||||
License.
|
||||
|
||||
|
||||
Section 7 -- Other Terms and Conditions.
|
||||
|
||||
a. The Licensor shall not be bound by any additional or different
|
||||
terms or conditions communicated by You unless expressly agreed.
|
||||
|
||||
b. Any arrangements, understandings, or agreements regarding the
|
||||
Licensed Material not stated herein are separate from and
|
||||
independent of the terms and conditions of this Public License.
|
||||
|
||||
|
||||
Section 8 -- Interpretation.
|
||||
|
||||
a. For the avoidance of doubt, this Public License does not, and
|
||||
shall not be interpreted to, reduce, limit, restrict, or impose
|
||||
conditions on any use of the Licensed Material that could lawfully
|
||||
be made without permission under this Public License.
|
||||
|
||||
b. To the extent possible, if any provision of this Public License is
|
||||
deemed unenforceable, it shall be automatically reformed to the
|
||||
minimum extent necessary to make it enforceable. If the provision
|
||||
cannot be reformed, it shall be severed from this Public License
|
||||
without affecting the enforceability of the remaining terms and
|
||||
conditions.
|
||||
|
||||
c. No term or condition of this Public License will be waived and no
|
||||
failure to comply consented to unless expressly agreed to by the
|
||||
Licensor.
|
||||
|
||||
d. Nothing in this Public License constitutes or may be interpreted
|
||||
as a limitation upon, or waiver of, any privileges and immunities
|
||||
that apply to the Licensor or You, including from the legal
|
||||
processes of any jurisdiction or authority.
|
||||
49
board/README.md
Normal file
49
board/README.md
Normal file
@@ -0,0 +1,49 @@
|
||||
# MicroEnv v2.x Board Designs
|
||||
|
||||
This is a collection of [EasyEDA](https://easyeda.com/) schematics and board desgins for the MicroEnv v2.x's components.
|
||||
|
||||
You can import the design definition files (`*.easyeda.json`) directly into EasyEDA via "File" -> "Open" -> "EasyEDA". The schematic is provided for reference in both EasyEDA and SVG formats; if you just wish to manufacture the boards, you only need to import the board definitions, then via "Fabrication" -> "One-click Order PCB/SMT" complete the order at [JLCPCB](https://jlcpcb.com). We order all boards in a black silkscreen with all other options as default.
|
||||
|
||||
You can also see the designs directly on [OSHWLab here](https://oshwlab.com/joshuaboniface/microenv-2-0).
|
||||
|
||||
The board design and images in this folder are © 2026 [Joshua M. Boniface](https://www.boniface.me) and licensed under the [Creative Commons Attribution-ShareAlike (BY-SA) 4.0](LICENSE) license.
|
||||
|
||||
## Schematic
|
||||
|
||||
The schematic is visible here in SVG format, and also as an EasyEDA definition in [schematic.easyeda.json](schematic.easyeda.json).
|
||||
|
||||

|
||||
|
||||
The individual parts can be found, with their labels (`R1`, etc.) in the [main README parts list](https://github.com/joshuaboniface/microenv/tree/v2.x?tab=readme-ov-file#parts-list).
|
||||
|
||||
## Board
|
||||
|
||||

|
||||
|
||||
This is the main board of the MicroEnv which contains all components, with the SHT45 sensor on a long (40mm) "neck" to isolate it from the other components.
|
||||
|
||||
The board is single-sided; there are no components on the reverse side.
|
||||
|
||||
## Assembly
|
||||
|
||||
Assembly can be accomplished either by hot-air reflow, or with a hotplate. The instructions are functionally identical for both except for the heating step (#5).
|
||||
|
||||
The hot-air process requires the least tools, but is finicky and error-prone. The hotplate process is much simpler and more forgiving, but requires a suitable hotplate. We recommend using the hotplate method for any more than a very small number of MicroEnv sensors.
|
||||
|
||||
1. Clean all PCBs thoroughly with isopropyl alcohol and paper towel.
|
||||
|
||||
2. Carefully apply solder paste to each pad, with the following guidelines:
|
||||
|
||||
* SHT45/SGP41: A very small amount on each pad, including the center pads; if you think it's not enough, it's just right.
|
||||
* Passive SMD components (R1, C1-3): A moderate amount on each pad focusing on the outer edges.
|
||||
* ESP32-C3: A very liberal amount on each pad for mechanical stability.
|
||||
|
||||
3. Place each component on its corresponding pad using tweezers. Ensure the components are properly aligned and then gently press them down into the solder paste.
|
||||
|
||||
**NOTE**: Placing each component after its corresponding solder paste can avoid accidental smudging.
|
||||
|
||||
4. Heat the hot air station to 240C; no higher! Apply heat to the **bottom** of the PCB until all the solder reflows. Check carefully for any bridges or failed joins and gently reflow in the same way as necessary. **Never apply heat directly to the sensors themselves!**
|
||||
|
||||
5. Perform electrical continuity tests to ensure there are no stray bridges.
|
||||
|
||||
The MicroEnv is now fully assembled and ready for final testing/provisioning.
|
||||
File diff suppressed because it is too large
Load Diff
187
board/board.easyeda.json
Normal file
187
board/board.easyeda.json
Normal file
File diff suppressed because one or more lines are too long
77
board/board.svg
Normal file
77
board/board.svg
Normal file
File diff suppressed because one or more lines are too long
|
After Width: | Height: | Size: 71 KiB |
File diff suppressed because one or more lines are too long
File diff suppressed because one or more lines are too long
|
Before Width: | Height: | Size: 75 KiB |
99
board/schematic.easyeda.json
Normal file
99
board/schematic.easyeda.json
Normal file
File diff suppressed because one or more lines are too long
5
board/schematic.svg
Normal file
5
board/schematic.svg
Normal file
File diff suppressed because one or more lines are too long
|
After Width: | Height: | Size: 78 KiB |
56
case/README.md
Normal file
56
case/README.md
Normal file
@@ -0,0 +1,56 @@
|
||||
# MicroEnv v2.x Case
|
||||
|
||||
This is a 3D-printable case/enclosure for the MicroEnv v2.0 module. This case optional for functionality, but provides excellent aesthetics and a good mounting point for the sensor.
|
||||
|
||||
The design features two individual parts:
|
||||
|
||||
* A bottom piece which holds the circuit board.
|
||||
* A top piece which covers the circuit board and sensors, with ample clearance for the components, a USB cable, and airflow for the sensors.
|
||||
|
||||
You can [tinker the design on TinkerCAD here](https://www.tinkercad.com/things/irFmvsATUlu-microenv-sensor-v2x-case).
|
||||
|
||||
The case design and images in this folder are © 2026 [Joshua M. Boniface](https://www.boniface.me) and licensed under the [Creative Commons Attribution-ShareAlike (BY-SA) 4.0](LICENSE) license.
|
||||
|
||||
## Printing
|
||||
|
||||
In this directory are 2 `.obj`-format CAD files providing the case. They should be compatible as-is with any slicing software and 3D printer model; no rotation or other transformations are required.
|
||||
|
||||
As a general set of parameters, all models should be printed with the following. All values are provided as their OrcaSlicer 2.3 names; your slicer may differ.
|
||||
|
||||
* 0.4mm nozzle/line width (or similar as provided by the slicer)
|
||||
* 0.16mm layer height, or a clean multiple thereof
|
||||
* No brim or raft
|
||||
* 7-10 wall loops
|
||||
* 7-10 shell layers (top + bottom)
|
||||
* 25% infill
|
||||
* Concentric patterns for infill
|
||||
* Concentric patterns for surfaces (visual only)
|
||||
* Back (preferred) or Aligned seams (visual only)
|
||||
|
||||
All other options are be specific to your printer, material, and desired effect.
|
||||
|
||||
The parts should be printed in a solid, durable material of any colour you wish. We use ABS in one of two colours (black or white) for our official prints.
|
||||
|
||||
### Case Models
|
||||
|
||||
These are the models that make up the case. Each case requires 1x `case-bottom` and 1x `case-top`.
|
||||
|
||||
#### `case-bottom`
|
||||
|
||||
This is the lower section of the case which directly holds the PCB and includes the male mating inserts. It also includes 3 vents for the SHT45.
|
||||
|
||||
#### `case-top`
|
||||
|
||||
This is the upper section of the case which covers the PCB and includes the female mating indents. It includes a pyramidal opening for the SGP41 sensor, 3 top and 4 side vents for the SHT45, and several cutouts for the USB connection.
|
||||
|
||||
## Assembly & Installation
|
||||
|
||||
To begin, print the parts above as required for the specific mounting type you want.
|
||||
|
||||
1. Insert the PCB into the `case-bottom` print, ensuring that the holes in the PCB align with the standoffs in the print. There may be some play due to board or case warping, so press it down as far as it will go.
|
||||
|
||||
2. Take the `case-top` print, and align the male/female mating components, ensuring that the SGP41 sensor is correctly centered within it opening.
|
||||
|
||||
3. Press down gently but firmly on a hard even surface to combine the mating components and close the case.
|
||||
|
||||
**NOTE**: Once mated, the two prints can not be easily separated without likely damaging the male mating inserts. If you must open the case again, you may need to re-print the `case-bottom` model.
|
||||
3061
case/case-bottom.obj
Normal file
3061
case/case-bottom.obj
Normal file
File diff suppressed because it is too large
Load Diff
4983
case/case-top.obj
Normal file
4983
case/case-top.obj
Normal file
File diff suppressed because it is too large
Load Diff
Binary file not shown.
|
Before Width: | Height: | Size: 174 KiB |
@@ -1,7 +1,7 @@
|
||||
---
|
||||
|
||||
###############################################################################
|
||||
# MicroEnv v1.0 ESPHome configuration
|
||||
# MicroEnv v2.0 ESPHome configuration
|
||||
###############################################################################
|
||||
#
|
||||
# Copyright (C) 2025 Joshua M. Boniface <joshua@boniface.me>
|
||||
@@ -26,11 +26,11 @@ esphome:
|
||||
friendly_name: "MicroEnv Sensor"
|
||||
project:
|
||||
name: "Joshua Boniface.microenv"
|
||||
version: "1.0"
|
||||
version: "2.0"
|
||||
min_version: 2025.11.0
|
||||
|
||||
dashboard_import:
|
||||
package_import_url: github://joshuaboniface/microenv/microenv.yaml@v1.x
|
||||
package_import_url: github://joshuaboniface/microenv/microenv.yaml@v2.x
|
||||
|
||||
esp32:
|
||||
board: esp32-c3-devkitm-1
|
||||
@@ -101,7 +101,7 @@ globals:
|
||||
initial_value: "0.3"
|
||||
|
||||
logger:
|
||||
level: INFO
|
||||
level: DEBUG
|
||||
baud_rate: 115200
|
||||
|
||||
api:
|
||||
|
||||
Reference in New Issue
Block a user